|
Terminal Finish/Material
As defined by
the JEDEC standard JESD97
The following
categories describe the Pb-free 2nd level interconnect terminal
finish/material
of components.
e1 |
|
SnAgCu
(also known as SAC) |
e2 |
|
Sn alloys
with no Bi or Zn (excluding SnAgCu) |
e3 |
|
Sn (Matte
Tin) |
e4 |
|
Noble/Precious
metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn) |
e5 |
|
SnZn, SnZnx
(no Bi) |
e6 |
|
Contains
Bi |
e7 |
|
Low temperature
solder (<150°C) containing In (no Bi) |
N/A |
|
Not applicable |
|
